It has been reported that the insulting properties of the barrier layer significantly affect the uniformity and quality of the depositing material [23]. Therefore, handling of the barrier layer during deposition of secondary material in the nanopores of AAO is very essential and important. Until now, three different kinds of electrochemical deposition Cilengitide concentration methods are applied for filling the pores of AAO template: direct current

(DC) electrodeposition [24], pulse electrodeposition (PED) [25], and alternating current (AC) electrodeposition [26]. Filling of AAO pores with metallic or magnetic nanowires via direct current (DC) electrodeposition is a tedious process and requires many steps. For instance, first AAO template has to be isolated from Al substrate, and this is achieved by dissolving the Al substrate in a toxic saturated solution of HgCl2. Subsequently, the barrier layer has to be etched away using chemical etching which often leads to the non-uniform widening of pores at the bottom. This process produces AAO template with different

pore diameters at the top and the bottom surface; resulting in non-uniform-diameter nanowires which is undesirable in device fabrication. Finally, a thin metallic contact is sputtered on one side of AAO which act as a cathode during electrodeposition. These steps are time consuming, and additionally, the handling of a fragile AAO template during the whole process is a very difficult task. Furthermore, electrodeposition via direct current in the pores of AAO without modification of barrier layer is generally MDV3100 solubility dmso unstable

and leads to a non-uniform filling of the AAO nanopores Selleckchem Dolutegravir due to the cathodic side reaction [25]. PED method is also widely used for the fabrication of metallic or magnetic nanowires in the nanopores of AAO templates. Ni [16, 25] and Co [27, 28] nanowires have been fabricated in the nanopores of AAO selleck screening library applying this method. Although the uniformity and pore-filling efficiency increased many folds compared to DC electrodeposition; however this method also needs modification of the barrier layer [16, 25–28]. In contrast, AC electrodeposition is a very powerful technique and it does not need the detachment of AAO template from the Al-substrate or modification of the barrier layer. Moreover, the Al-substrate is used as cathode during electrodeposition. To the best of the author knowledge, Co-Ni binary alloy nanowire electrodeposition in the AAO template without modification of the barrier layer has not been reported to date. In this study, the fabrication of dense Co-Ni binary alloy nanowires within the nanopores of AAO templates via AC electrodeposition has been reported. Co-Ni binary alloy nanowires with different composition were co-deposited into the nanopores of AAO templates from a single sulfate bath of Co and Ni without modifying the barrier layer at room temperature.